ELECTROLYTIC PLATING APPARATUS AND METHOD

One embodiment of the present invention provides an electrolytic plating apparatus and an electrolytic plating method capable of disposing a sealing member and a contact member at an optimal locationand individually adjusting the pressing of the sealing member and the contact member. The electrolytic plating apparatus includes a plating tank that is filled with plating liquid; a moving mechanismconfigured to vertically move a processing target substrate in a direction normal to a surface of the plating liquid; a seal member that is disposed at a peripheral edge portion of a processing targetsurface of a processing target substrate and is configured to seal the plating liquid to a center side of the processing target surface when the processing target substrate is immersed in the platingtank; and a contact member that is separated from the seal member and is electrically connected to the processing target surface. 本发明的一方式提供一种可将密封部件与接触部件配置在最佳场所，且可个别地调整密封部件与接触部件的按压的电解镀敷装置及电解镀敷方法。实施方式的电解镀敷装置具备：镀敷槽，能填充镀敷液；密封部件，配置在