PACKAGE WITH BUILT-IN THERMOELECTRIC ELEMENT

A package with a built-in thermoelectric element according to one embodiment of the present disclosure is provided with a thermoelectric conversion module which comprises a first substrate having first and second main surfaces, a second substrate having third and fourth main surfaces, and a plurality of thermoelectric elements that are sandwiched between the first substrate and the second substrate and are arranged along the second main surface and the third main surface. This package with a built-in thermoelectric element is also provided with: a frame body which is bonded to the first and second substrates so as to form an airtight space that surrounds the plurality of thermoelectric elements between the first and second substrates; and an arrangement part which is arranged on the firstmain surface of the first substrate or the fourth main surface of the second substrate, and to which another device is connected. The first substrate is provided with: an inner conductor pattern whichis arranged on the second