SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME

The invention provides a semiconductor device and a fabricating method of the same. The semiconductor device includes a first substrate having a first face and a second face, a first semiconductor chip on the first face, a first wire which electrically connects the first semiconductor chip and the first substrate, a first resin which seals the first semiconductor chip and the first wire, a first metal bump on the second face, a second substrate below the first substrate, the second substrate having a third face and a fourth face, a second semiconductor chip on the third face and electrically connected to the first metal bump, a second wire which electrically connects the second semiconductor chip and the second substrate, a second resin between the second face and the third face, the second resin sealing the first metal bump, the second semiconductor chip and the second wire, and a second metal bump on the fourth face. 本实施方式提供一种半导体装置及其制造方法。实施方式的半导体装置具备第1衬底与第2衬底。将至少1个第1半导体芯片设置在第1衬底的第1面上。第1导线将第1半导体芯片与第1衬底之间电连接。