Modeling and analyzing method for generalized microscopic stress concentration phenomenon of machined surface
The invention relates to a modeling and analyzing method for a generalized microscopic stress concentration phenomenon of a machined surface. The modeling method comprises the following steps: S1, acquiring a real stress-strain curve of a matrix material structure of a test piece to be processed; S2...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a modeling and analyzing method for a generalized microscopic stress concentration phenomenon of a machined surface. The modeling method comprises the following steps: S1, acquiring a real stress-strain curve of a matrix material structure of a test piece to be processed; S2, obtaining a machined surface microstructure curve of the machined test piece; S3, treating the plastic deformation layer of the processed test piece to obtain a plurality of sub plastic deformation layers; S4, acquiring a stress-strain curve of each sub plastic deformation layer according to the real stress-strain curve of the test piece to be processed and the plurality of sub plastic deformation layers; S5, constructing a two-dimensional layered finite element analysis model for analyzing the surface of the machined test piece by utilizing the machined surface microstructure curve of the machined test piece, the attribute information of the matrix material structure, the stress-strain curve of each sub-plastic |
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