HOST COMPUTER SYSTEM AND HEAT DISSIPATION APPARATUS AND SEPARATION MECHANISM THEREOF
A host system, a heat dissipation device and a separation mechanism thereof are provided. The heat dissipation device is suitable for at least one first circuit device and at least one second circuit device, and comprises a housing having a front side and a rear side; and at least one separating mec...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A host system, a heat dissipation device and a separation mechanism thereof are provided. The heat dissipation device is suitable for at least one first circuit device and at least one second circuit device, and comprises a housing having a front side and a rear side; and at least one separating mechanism disposed in the housing, wherein the at least one first circuit device and the at least one second circuit device are disposed on two sides of the separating mechanism, respectively, and the at least one first circuit device is not aligned with the at least one second circuit device, and the separating mechanism includes a separating plate for separating the air flow introduced from the front side. The invention can improve the heat dissipation of the circuit device, enhance the heat dissipation efficiency and increase the air flow speed with lower cost.
一种主机系统及其散热装置与分隔机制。该散热装置适用于至少一第一电路装置与至少一第二电路装置,该散热装置包括一壳体,该壳体具有一前侧与一后侧;以及至少一分隔机制,该至少一分隔机制设于该壳体内,该至少一第一电路装置与该至少一第二电路装置分别设于该分隔机制的两侧,并且该至少一第一电路装置非对齐于该至少一第二电路装置, |
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