Integrated circuit manufacturing device and method
The invention discloses an integrated circuit manufacturing device and method, and belongs to the technical field of integrated circuit manufacturing. The integrated circuit manufacturing device comprises an ion sputtering machine and a packaging machine and further comprises a substrate preparation...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an integrated circuit manufacturing device and method, and belongs to the technical field of integrated circuit manufacturing. The integrated circuit manufacturing device comprises an ion sputtering machine and a packaging machine and further comprises a substrate preparation machine, wherein the substrate preparation machine is provided with a substrate preparation box, the substrate preparation box is equipped with moving wheels, the substrate preparation box is provided with handles, the substrate preparation box is connected with a box door, the outer surface of the box door is equipped with a control panel, the control panel is internally provided with an intelligent production system, the left side surface of the substrate preparation box is provided with a side placement groove at the middle part, the lower groove surface of the side placement groove is provided with a lower notch, the inner groove surface of the side placement groove is provided with a side notch, the side plac |
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