METHOD FOR ESTABLISHING INTEGRALLY BONDED CONNECTION
The invention relates to a method for establishing an integrally bonded connection (3) between a first semi-finished part (1) and a second semi-finished part (2). 本发明涉及在第一半成品(1)和第二半成品(2)之间建立材料配合连接(3)的方法。
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method for establishing an integrally bonded connection (3) between a first semi-finished part (1) and a second semi-finished part (2).
本发明涉及在第一半成品(1)和第二半成品(2)之间建立材料配合连接(3)的方法。 |
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