Semiconductor manufacturing apparatus

The invention relates to a semiconductor manufacturing apparatus for selectively discharging a bonding material from a plurality of nozzles. The semiconductor manufacturing apparatus (100) includes one syringe (10) providing a bonding material (M1) and a coating unit (20) connected to the syringe (1...

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Bibliographische Detailangaben
1. Verfasser:	UOZUMI SHUJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to a semiconductor manufacturing apparatus for selectively discharging a bonding material from a plurality of nozzles. The semiconductor manufacturing apparatus (100) includes one syringe (10) providing a bonding material (M1) and a coating unit (20) connected to the syringe (10). The nozzles (N1a, N1b) are mounted on the coating unit (20). The coating unit (20) includes a switching mechanism (Mc1) that allows the bonding material (M1) provided by the syringe (10) to be selectively ejected from the nozzles (N1a, N1b). 本发明涉及将接合材料从多个喷嘴选择性地喷出的半导体制造装置。半导体制造装置(100)具备涂敷单元(20)和1个注射器(10)，该1个注射器(10)供给接合材料(M1)，该涂敷单元(20)与注射器(10)连接。在涂敷单元(20)安装有喷嘴(N1a、N1b)。涂敷单元(20)具有使从注射器(10)供给的接合材料(M1)从喷嘴(N1a、N1b)选择性地喷出的切换机构(Mc1)。