Light emitting module, driving chip and driving method

The invention discloses a light-emitting module, which comprises a substrate, a driving wafer, at least one light-emitting unit and a flexible printed circuit board. The driving chip is disposed on the substrate in a COG manner or disposed on the flexible printed circuit board in a COF or TCF manner...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN YONGXU, ZHAN XINZHE
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a light-emitting module, which comprises a substrate, a driving wafer, at least one light-emitting unit and a flexible printed circuit board. The driving chip is disposed on the substrate in a COG manner or disposed on the flexible printed circuit board in a COF or TCF manner, and the light-emitting unit is disposed on the substrate and connected to the driving chip. The driving chip provides a data signal or a second driving signal to the light-emitting unit, and the light-emitting unit comprises a micro light-emitting diode or a sub-micro light-emitting diode. A driving chip and a driving method are also provided. 本发明公开了一种发光模块,其包括基板、驱动晶片、至少一发光单元以及可挠式印刷电路板。驱动晶片以COG方式配置于基板上,或是以COF或TCF方式配置于可挠式印刷电路板,而发光单元配置于基板上并连接驱动晶片。驱动晶片提供数据信号或第二驱动信号给发光单元,发光单元包括微发光二极管或次微发光二极管。一种驱动晶片以及驱动方法亦被提出。