Method of planting spring corn by continuable mulching

The invention discloses a method of planting spring corn by continuable mulching. The method comprises preparing a land, mulching, seeding, applying fertilizers, harvesting, and removing mulch film. The application of a no-tillage technique to the planting process helps prevent film residue contamin...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BAI CHONGJIU, CHEN BAOQING, YAN CHANGRONG, LIU QIN, DONG WENYI, LIU ENKE
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a method of planting spring corn by continuable mulching. The method comprises preparing a land, mulching, seeding, applying fertilizers, harvesting, and removing mulch film. The application of a no-tillage technique to the planting process helps prevent film residue contamination caused by mixing of the mulch film in soil; damage to the mulch film is prevented through thecontinuous use of thickened high-strength weatherable mulch film, wide and narrow row seeding on a film-side bare land and harvesting with high stubbles left; the mulch film is more recyclable; the crop yield is increased through the continuous covering of the mulch film, water holding, temperature retention and wide and narrow row planting; since the cost of the steps, such as mulch film materialapplication, tilling, mulching and film removing, is reduced, economic benefit of spring corn planting is increased. 本发明公开一种可持续地膜覆盖春玉米的种植方法,包括整地、覆膜、播种、施肥、收获和揭膜,本发明通过在种植过程中,通过免耕技术的采用,避免地膜混入土壤形成残膜污染,通过加厚高强耐候性地膜的连续采用、膜侧裸地宽窄行播种、高