Method of planting spring corn by continuable mulching
The invention discloses a method of planting spring corn by continuable mulching. The method comprises preparing a land, mulching, seeding, applying fertilizers, harvesting, and removing mulch film. The application of a no-tillage technique to the planting process helps prevent film residue contamin...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method of planting spring corn by continuable mulching. The method comprises preparing a land, mulching, seeding, applying fertilizers, harvesting, and removing mulch film. The application of a no-tillage technique to the planting process helps prevent film residue contamination caused by mixing of the mulch film in soil; damage to the mulch film is prevented through thecontinuous use of thickened high-strength weatherable mulch film, wide and narrow row seeding on a film-side bare land and harvesting with high stubbles left; the mulch film is more recyclable; the crop yield is increased through the continuous covering of the mulch film, water holding, temperature retention and wide and narrow row planting; since the cost of the steps, such as mulch film materialapplication, tilling, mulching and film removing, is reduced, economic benefit of spring corn planting is increased.
本发明公开一种可持续地膜覆盖春玉米的种植方法,包括整地、覆膜、播种、施肥、收获和揭膜,本发明通过在种植过程中,通过免耕技术的采用,避免地膜混入土壤形成残膜污染,通过加厚高强耐候性地膜的连续采用、膜侧裸地宽窄行播种、高 |
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