HEAT TREATMENT METHOD

Provided is a heat treatment method capable of shortening the time required for loading and unloading a substrate into and from a chamber. In the heat treatment method of the present invention, at a time (t6) before a time (t7) at which a semiconductor wafer is cooled to a transportable temperature...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ITO YOSHIO, YOSHII HIROKI, FURUKAWA MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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