Rapid curing type organosilicone sealant

The invention relates to the technical field of organosilicone sealants, in particular to a rapid curing organosilicone sealant. The sealant is prepared from a component A and a component B. The component A is prepared from 100 parts of alpha,omega-dihydroxyl polydimethylsiloxane, 50 parts of hydroxy terminated dimethyl silicone oil, 10-20 parts of dimethyl silicone oil, 50-100 parts of a filler,1-13 parts of a toughener, 0.1-5 parts of a coupling agent and 0.2-4 parts of a catalyst; the component B is prepared from 30-60 parts of dimethyl silicone oil, 5-10 parts of a curing agent, 1-5 partsof a curing accelerator, 20-35 parts of an amino silicone oil and 0.1-5 parts of a coupling agent. Accordingly, by means of formula blending, the reactivity of hydroxyl and organic amine is fully played, and low-temperature rapid curing is achieved. 本发明涉及一种有机硅密封胶技术领域，具体涉及一种快速固化的有机硅密封胶技术领域。所述密封胶包括A、B组分。A组分包括α，ω-二羟基聚二甲基硅氧烷100份，端羟基二甲基硅油50份，二甲基硅油10-20份，填料50-100份、增韧剂1-13份、偶联剂0.1-5份、催化剂0.2-4份；B组分包括二甲基硅油30-60份，固化剂5-10份、固化促进剂1-5份