Superstrate and a method of using the same

A superstrate and a method of using the same are provided. A body of the superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. The body ofa superstrate can have bending characteristics that are well suited to achieve both conformal and planarization behavior. The body can have a surface and a thickness in a range of t1 to t2, t1=(Pd4/2Eh)1/3; t2=(5Pd4/2Eh)1/3; P is a pressure corresponding to a capillary force between the body and a planarization precursor material; d is a bending distance; E is Young's modulus for the body; and his a step height difference between two adjacent regions of a substrate. In an embodiment, a thickness can be selected and used to determine the maximum out-of-plane displacement, wmax, for conformalbehavior is sufficient and that wmax for planarization behavior is below a predetermined threshold. 公开了覆板及其使用方法。覆板的主体可用于在具有不均匀形貌的基板上形成自适应平坦化层。覆板的主体可具有非常适合于实现共形和平坦化行为二者的弯曲特性。主体可以具有表面和在t到t范围内的厚度，t＝(Pd/2Eh)，t＝(5Pd/2Eh)；P是对应于主体和平坦化