Splitting machine cutter clamping device for semiconductor material dissociation

The invention relates to a splitting machine cutter clamping device for semiconductor material dissociation. The device comprises a connection spring, baffles, a force sensor, a splitting cutter clamp, a front fixing plate, a guide rail and a rear fixing plate, the guide rail is arranged on the rear fixing plate, the front fixing plate is fixedly connected with the rear fixing plate through the guide rail, the two ends of the connection spring are connected with the rear fixing plate and one baffle correspondingly, the baffles and a leveling pre-tightening device are fixed to the front fixingplate, one end of the leveling pre-tightening device is connected with the splitting cutter clamp, a T-shaped groove is formed in the splitting cutter clamp and used for fixing a ceramic splitting cutter required by splitting, and the force sensor is fastened in the splitting cutter clamp, the pre-tightening mechanism and the baffles and used for measuring the vertical load required in the semiconductor material dissociat