SYSTEMS AND METHODS FOR WETTING SUBSTRATES

Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a pluralityof features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate. 润湿半导体基板的方法，可包括于容纳有所述半导体基板的处理腔室中形成受控的气体氛围。半导体基板可限定多个特征，其中可包括通孔。所述方法可包括使润湿剂流入处理腔室。腔室压力可维持在低于约100kPa。所述方法可亦包括润湿限定于所述基板中的所述多个特征。