Wafer processing method

The invention discloses a wafer processing method. According to the wafer processing method, wafers have a higher degree of freedom of movement compared with a grinding device, so that each part is more uniformly ground to contribute to more uniform thickness as well as higher yield of the wafers. In addition, batch processing and batch production are adopted, so that the efficiency is greatly improved. Moreover, only shape of the processing material changes simply while no machine equipment changes, so that the operation is simple, no additional modification cost is needed, and the method isquite economical and practical. 本发明公开了一种晶片加工方法，本发明的加工方法中晶片相对于研磨装置活动自由度更大，使得每部分被研磨的机会更平均，最后导致晶片的厚薄更均一，良品率更高。另外本发明采取批量加工，批量生产，大大提升了效率。再有本发明仅仅是加工材料形状的简单变化，机器设备都未发生任何变化，因此操作简单，也无需额外的改造成本，十分经济实惠。