WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD

A wiring substrate 1 comprises: a support 10 including at least one woven fabric 11 that is woven using weaving yarns 12, 13, which are respectively constituted by bundling insulating fibers 121, 131;and a conductor 20 supported by the support 10. The conductor 20 includes a first conduction path 21 that is provided to a first main surface 101 of the support 10 and that extends in the plane direction of the first main surface 101. The first conduction path 21 includes at least one of a first conductor section 211 that exists in a basket hole 14 of the woven fabric 11, and a first intermediatesection 212 that exists in a gap between the insulating fibers 121, 131. 布线基板(1)具备包含使用将绝缘性纤维(121、131)捆束而分别构成的梭织纱(12、13)织造出的至少一个织布(11)的支承体(10)、和支承于支承体(10)的导电体(20)，导电体(20)包含设置于支承体(10)的第1主面(101)并沿第1主面(101)的平面方向延伸的第1导电路(21)，第1导电路(21)具有存在于织布11的编织孔(14)的第1导体部分(211)和存在于绝缘性纤维(121、131)彼此之间的间隙的第1夹设部分(212)中的至少一者。