POLISHING DEVICE

The invention provides a polishing method and a polishing device which can improve a polishing rate by adjusting a surface temperature of a polishing pad, and can control a polishing profile of a substrate to be polished. A polishing method of polishing a substrate by pressing the substrate to a polishing pad on a polishing table includes: a surface temperature adjusting process of the polishing pad 3 which adjusts a surface temperature of the polishing pad 3; and a polishing process of polishing the substrate by pressing the substrate to the polishing pad 3 at the adjusted surface temperature. In the surface temperature adjusting process of the polishing pad 3, the surface temperature of a part of a region of the polishing pad 3, which is in contact with the substrate, is adjusted so thata temperature change rate of a temperature profile in a radial direction of a surface of the polishing pad 3 during the polishing process becomes constant in a polishing pad radial direction. 本发明提供一种通过调整研磨垫的表面温度可使研磨率提高，并且也可控