Semiconductor Wafer and Method for Forming Semiconductor

The embodiment of the invention provides a semiconductor wafer and a method for forming a semiconductor. The semiconductor wafer includes: a first semiconductor component having a first device; a second semiconductor component having a second device; an insulation layer laterally extending to the fi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YUKI TANAKA, SHINJI KUDOH, TOMONORI HOTATE, HIROSHI SHIKAUCHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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