Epoxy resin composition, preparing method and application thereof and aluminum base copper-clad plate

The invention discloses an epoxy resin composition, a preparing method and application thereof and an aluminum base copper-clad plate. The composition is prepared from solid epoxy resin, liquid epoxyresin, a flexibilizer, a curing agent, a curing accelerator, an inorganic filler, a solvent, tetrapod...

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Bibliographische Detailangaben
Hauptverfasser:	LI QIANGLI, ZHENG KEMIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BLASTING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIGHTING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WEAPONS
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Beschreibung
Zusammenfassung:	The invention discloses an epoxy resin composition, a preparing method and application thereof and an aluminum base copper-clad plate. The composition is prepared from solid epoxy resin, liquid epoxyresin, a flexibilizer, a curing agent, a curing accelerator, an inorganic filler, a solvent, tetrapod-like zinc oxide whiskers, a bisphenol A poly(ether-ester) blocked epoxy resin polymers and polycarboxylic acid polymers. The epoxy resin composition has good heat resistance, thermal conductivity and electric insulativity. The two-sided aluminum base copper-clad plate prepared by means of the epoxy resin composition has good heat resistance, the thermal conductivity and electric insulativity are significantly improved, the thermal conductivity coefficient can be up to 2.3 W/m.K, the safety ofan LED product is effectively guaranteed, and the service life is effectively prolonged. 本发明公开了一种环氧树脂组合物及其制备方法和应用、铝基覆铜板。该组合物包括下述组分：固态环氧树脂、液态环氧树脂、增韧剂、固化剂、固化促进剂、无机填料、溶剂、四针状氧化锌晶须、双酚A聚醚酯嵌段环氧树脂聚合物和聚羧酸类聚合物。本发明中的环氧树脂组合物具有良好的耐热性、导热性和电