MOUNTING BOARD AND ELECTRONIC DEVICE

The invention relates to a mounting board and an electronic device. The mounting substrate according to one embodiment of the present technology is provided with a wiring substrate (30), a fine L/S layer (40) that is formed in contact with the upper surface of the wiring substrate, and a plurality of elements (12, 13) that are arranged in a matrix on the upper surface of the fine L/S layer. The wiring substrate has a plurality of first wires (SigB1, Gate2), and a plurality of vias (14) of which a plurality are provided for each first wire and which are arranged at a period that is an integer multiple of the array period of the elements. The elements which are adjacent on the fine L/S layer are electrically connected, via one or more second wires (16) in the fine L/S layer, to a common via. 本发明涉及安装基板和电子装置。根据本技术的实施例的安装基板设置有：布线基板(30)；细L/S层(40)，形成为与布线基板的顶部表面接触；以及多个元件(12、13)，以矩阵状布置在细L/S层的顶部表面上。布线基板具有多条第一布线线路(SigB1,Gate2)以及多个通孔(14)，为每条第一布线线路中的提供通孔中的两个或更多个，并且以多个元件的布置周期的整数倍的周期布置多个通孔(14)。细L/S层上相邻的多个元件通过细L/S层中的一条或多条第二布