Preparation method of film material for electronic products

The invention discloses a preparation method of a film material for electronic products and belongs to the technical field of electronic products. The prepared film material has the advantages that when the film material is used for packaging the surface of an electronic product, if the temperature of the surface of the electronic product rises, adhesive force among polyimide resin molecules is lowered, the Brownian movement of nano conductive particles allow the nano conductive particles to gather to gradually increase super-conductive clusters to form a conductive network, and the conductivity of the film material is increased; due to the fact that the conductive particles are evenly dispersed in the polyimide resin matrix, a high mechanical interlocking effect among the conductive particles can be generated; meanwhile, due to the fact that silver is pure metal, high interaction between the silver and a polymer matrix does not exist, the film material can keep most of excellent performance such as high ther