SEMICONDUCTOR DEVICE

According to one embodiment of the present invention, a semiconductor device is provided with a first metal plate, a second metal plate and two or more semiconductor units. The two or more semiconductor units are arranged on the first metal plate. Each one of the two or more semiconductor units comp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE NAOTAKE, HISAZATO YUUJI, TAKIMOTO KAZUYASU, IIO NAOTAKA, ICHIKURA YUTA, ITO HIROAKI, TADA NOBUMITSU, YAMANARI NAOKI, MATSUMURA HITOSHI, OHBU TOSHIHARU, HIRATSUKA DAISUKE, SEKIYA HIROKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	According to one embodiment of the present invention, a semiconductor device is provided with a first metal plate, a second metal plate and two or more semiconductor units. The two or more semiconductor units are arranged on the first metal plate. Each one of the two or more semiconductor units comprises a first metal member, a second metal member and a semiconductor element. The first metal member comprises a first connection surface that is connected to the first main surface. The second metal member comprises a second connection surface that is connected to the second main surface. The semiconductor element comprises an active region which has surfaces that respectively face the first connection surface and the second connection surface. The area of the first connection surface is larger than the area of the surface of the active region facing the first connection surface. The area of the second connection surface is larger than the area of the surface of the active region facing the second connection surf