Seal ring structure, semiconductor die, and method for detecting cracks on semiconductor die

The embodiment of the invention provides a seal ring structure, a semiconductor die, and a method for detecting cracks on the semiconductor die. The seal ring structure includes a seal ring on a semiconductor substrate. The seal ring includes a first interconnect element and a plurality of second interconnect elements. The first interconnect element is formed on a shallow trench isolation (STI) region and a first group of P-type doping regions over the semiconductor substrate. The second interconnect elements are formed below the first interconnect element and on a second group of P-type doping regions over the semiconductor substrate. The second interconnect elements are electrically separated from the first interconnect element, and the first and second groups of P-type doping regions are separated by the STI region. In virtue of such a seal ring structure, the second interconnect elements can be used as sensing points to detect whether a crack is present in the semiconductor die. 本发明实施例提供了一种密封环结构，半导体管芯和侦测半