Sensor head and manufacturing method thereof

The invention relates to a sensor head (1) comprising an accommodating portion (4) at least one form of which is a through opening of the sensor head (1) and at least one sensor element (7), with thesensor element being accommodated in the accommodating portion (4). The accommodating portion (4) is...

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Bibliographische Detailangaben
Hauptverfasser:	REMUS ROBERT, WINKLER MARTIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT LINE CONNECTORS MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	The invention relates to a sensor head (1) comprising an accommodating portion (4) at least one form of which is a through opening of the sensor head (1) and at least one sensor element (7), with thesensor element being accommodated in the accommodating portion (4). The accommodating portion (4) is sealed through a cover plate (2, 3) at both sides of the through opening respectively. The invention also relates to a manufacturing method of the sensor head. 本发明涉及一种传感器头(1)，其包括至少一个形式为所述传感器头(1)的贯通开口的容纳部(4)以及至少一个传感器元件(7)，所述传感器元件容纳在所述容纳部(4)中。所述容纳部(4)在其贯通开口的两侧上分别借助于一盖板(2、3)封闭。此外，本发明还涉及一种用于制造传感器头的方法。