New compound, composition containing the same and cured product thereof

The present invention relates to a novel compound of chemical formula 1, a composition comprising the same, and an organic electronic device encapsulated with an encapsulating material of a cured product comprising the composition, wherein X and Y are independently direct coupling, and O or S, X and Y are not simultaneously direct coupling; R1 and R2 are independently hydrogen, halogen, an alkyl group having 1 to 30 carbon atoms, a cycloalkyl group having 3 to 30 carbon atoms, a heterocycloalkyl group having 3 to 30 carbon atoms, a heteroaryl group having 3 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a combination thereof; R3 is an alkyl group having 1 to 30 carbon atoms, a cycloalkyl group having 3 to 30 carbon atoms, a heterocycloalkyl group having 3 to 30 carbon atoms, a heteroaryl group having 3 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a combination thereof, each of which comprises a substituted or unsubstituted state. 本发明涉及化学式1的新型化合物、含其的组合物及用含该组合物的固化物的封装材料封装