PCB thickness measurement system

The embodiment of the invention discloses a PCB thickness measurement system, so as to solve the problem of low precision of back drilling in the prior art. In the method disclosed in the embodiment of the invention, a PCB fixing device, a thickness measurement system and a control device are arranged, wherein the PCB fixing device is used for clamping and fixing the edge position of the PCB; thethickness measurement system comprises a first thickness measurement mechanism and a second thickness measurement mechanism, and the first thickness measurement mechanism and the second thickness measurement mechanism are arranged at two sides of the PCB; and the control device is used to acquire a first distance and a second distance and calculate the thickness of the PCB at a first target position based on the first distance, the second distance and a reference position distance. 本发明实施例公开了一种PCB的厚度测量系统，用于解决现有技术中背钻精度较低的问题。本发明实施例方法包括：PCB固定装置、厚度测量系统以及控制装置；PCB固定装置用于对PCB的边缘位置进行夹紧固定；厚度测量系统包括第一厚度测量机构和第二厚度测量机构，第一厚度测量机构和第二厚度测