Asymmetric high-multilayer rigid-flexible combined circuit board and preparation method thereof

The invention provides an asymmetric high-multilayer rigid-flexible combined circuit board. The asymmetric high-multilayer rigid-flexible combined circuit board is composed of a thick-layer rigid-flexible combined area, a pure dynamic flexible bending area and a thin-layer rigid-flexible combined area. The thick-layer rigid-flexible combined area comprises rigid core boards, flexible core boards and bonding layers which are combined; the pure dynamic flexible bending area comprises a flexible core board and protective films, and the protective films are symmetrically arranged on the surface ofthe circuit of the pure dynamic flexible bending area of the flexible core board; the thin-layer rigid-flexible combined are comprises rigid core plates, flexible core plates and bonding layers whichare arranged in a staggered mode. The asymmetric high-multilayer rigid-flexible combined circuit board and the preparation method thereof can better meet the three-dimensional assembly requirement ofelectronic products, save