ELECTRONIC DEVICE IMAGE SENSOR

An electronic device image sensor is disclosed. An electronic device includes a substrate semiconductor wafer with semiconductor portions separated from one another by through-passages. Electronic circuits and a dielectric layer with a network of electrical connections are formed at a front face of the substrate semiconductor wafer. Electrically conductive fillings are contained within the through-passages and are connected to the network of electrical connections. Interior dielectric layers for anti-diffusion protection are provided in the through-passages between the electrically conductivefillings and the semiconductor portions. Back side dielectric layers are joined to the interior dielectric layers. 本文公开了电子器件图像传感器。一种电子器件包括具有通过贯穿通道彼此分离的半导体部分的衬底半导体晶片。电子电路和具有电连接网络的电介质层形成在衬底半导体晶片的正面。导电填料被包含在贯穿通道内并且连接到电连接网络。用于反扩散保护的内部电介质层设置在导电填料与半导体部分之间的贯穿通道中。背面电介质层连接到内部电介质层。