ELECTRONIC ASSEMBLY WITH ENHANCED HIGH POWER DENSITY

An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, wherein each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening. The switching circuit chipset has a plurality of lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board. 一种电子组件包括：栅极驱动模块，所述栅极驱动模块包括夹在一起的多个电路板层，其中每层具有与其他层对准的中心开口。开关电路芯片组位于所述中心开口中。所述开关电路芯片组具有多个引线框架，以用于提供到所述开关电路芯片组的电连接。所述引线框架能够与多个电路板层的两层或更多个层中的容纳部对准，以便于使得所述引线框架的接触部分与电路板上的相应的导电焊盘对准。