SEMICONDUCTOR PACKAGE HAVING WAFER-LEVEL ACTIVE DIE AND EXTERNAL DIE MOUNT

Semiconductor packages and package assemblies having active dies and external die mounts on a silicon wafer, and methods of fabricating such semiconductor packages and package assemblies, are described. In an example, a semiconductor package assembly includes a semiconductor package having an active die attached to a silicon wafer by a first solder bump. A second solder bump is on the silicon wafer laterally outward from the active die to provide a mount for an external die. An epoxy layer may surround the active die and cover the silicon wafer. A hole may extend through the epoxy layer abovethe second solder bump to expose the second solder bump through the hole. Accordingly, an external memory die can be connected directly to the second solder bump on the silicon wafer through the hole. 描述了具有硅晶片上的有源管芯和外部管芯底座的半导体封装和封装组件，以及制作这样的半导体封装和封装组件的方法。在示例中，半导体封装组件包括具有通过第一焊料凸块而附接到硅晶片的有源管芯的半导体封装。第二焊料凸块在硅晶片上从有源管芯横向向外以提供用于外部管芯的底座。环氧树脂层可以围绕有源管芯并且覆盖硅晶片。孔可以在第二焊料凸块上方贯穿环氧树脂层以通过该孔暴露第二焊料凸块。因此，外部存储器管芯可以通过该孔而直接连接到硅晶片上的第二焊料凸块。