NEXT GENERATION WARPAGE MEASUREMENT SYSTEM
Systems, apparatuses and methods for determining a surface profile of a substrate are provided. In one embodiment, a method includes projecting a signal having a vertical component/profile across thesurface of the substrate from a plurality of locations along a first side of the substrate, capturing...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Systems, apparatuses and methods for determining a surface profile of a substrate are provided. In one embodiment, a method includes projecting a signal having a vertical component/profile across thesurface of the substrate from a plurality of locations along a first side of the substrate, capturing the projected signals at each of a plurality of respective locations across the surface of the substrate and determining a surface profile for the substrate using the captured signals. The process can be automated using a controller having predetermined projection and capture positions along respective sides of the substrate, where a surface profile of the substrate can be automatically determined by the controller using the captured signals.
提供了用于确定基板表面轮廓的系统、装置和方法。在一个实施例中,一种方法包括以下步骤:从沿着所述基板的第一侧的多个位置跨所述基板的所述表面投射具有垂直分量/轮廓的信号;在位于所述基板的所述表面对面的多个对应位置中的每一个位置处捕捉所述经投射信号;和使用所述捕捉到的信号来确定所述基板的表面轮廓。所述过程可使用控制器来自动化,所述控制器具有沿着基板的对应侧的预定的投射和捕捉位置,其中可通过控制器使用捕捉到的信号来自动确定基板的表面轮廓。 |
---|