Semiconductor device and method for detecting crack of semiconductor device

The embodiment of the invention provides a semiconductor device and a method for detecting a crack of the semiconductor device. The semiconductor device includes a crack sensor having a SBD structure;the SBD structure at least is configured on a first side of a semiconductor body and configured to d...

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Bibliographische Detailangaben
Hauptverfasser: YUKI TANAKA, SHINJI KUDOH, TOMONORI HOTATE, HIROSHI SHIKAUCHI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The embodiment of the invention provides a semiconductor device and a method for detecting a crack of the semiconductor device. The semiconductor device includes a crack sensor having a SBD structure;the SBD structure at least is configured on a first side of a semiconductor body and configured to detect a crack on the first side of the semiconductor body. Therefore, a crack on the surface of thesemiconductor device can be detected by the crack sensor with high precision and simple structure. 本发明实施例提供一种半导体器件以及检测半导体器件的裂纹的方法。该半导体器件包括裂纹传感器,该裂纹传感器具有SBD结构;该SBD结构至少配置在半导体本体的第一面上,并且配置为检测该半导体本体的第一面上的裂纹。因此,该裂纹传感器能够检测该半导体器件的表面上的裂纹,精度高且结构简单。