Preparation method of polyimide layer

The invention relates to a preparation method of a polyimide layer. The preparation method comprises the following steps: removing charges on the surface of a metal layer; forming the polyimide layeron the surface of a metal layer, coating the surface of the polyimide layer with a photosensitive material and carrying out exposure treatment; and developing the photosensitive substance and the polyimide layer by using developing solution to form a required polyimide layer pattern. The charges on the surface of the metal layer are removed before the polyimide layer is formed, and the potential on the surface of the metal layer is changed, so that the problem that the surface of the metal layer is eroded by the developing solution in the development step when the polyimide layer is prepared is effectively solved. 本发明涉及一种聚酰亚胺层的制备方法，包括：去除金属层表面的电荷；在金属层表面形成聚酰亚胺层，在所述聚酰亚胺层表面涂覆光敏性物质并进行曝光处理；使用显影液对所述光敏性物质和所述聚酰亚胺层进行显影，形成所需的聚酰亚胺层图案。本发明在形成聚酰亚胺层之前去除金属层表面的电荷，改变了金属层表面的电位，从而有效解决了制备聚酰亚胺层时的显影步骤中显影液对金属层表面的侵蚀问题。