Multi-plate test piece surface grinding and polishing device and method

The invention provides a multi-plate test piece surface grinding and polishing device and method. The multi-plate test piece surface grinding and polishing device includes a base, one or more grindingand polishing assemblies, and a transmission assembly. The base forms one or more test piece placeme...

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Bibliographische Detailangaben
Hauptverfasser: YU MIN, ZHANG SHUAISHUAI, CHEN SHUN, GOU RUIBIN, LU CHAO, ZHANG JUNXIANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a multi-plate test piece surface grinding and polishing device and method. The multi-plate test piece surface grinding and polishing device includes a base, one or more grindingand polishing assemblies, and a transmission assembly. The base forms one or more test piece placement areas. Each test piece placement area comprises a plurality of test piece placement slot sets arranged in different directions and along the same center. Each test piece placement slot group includes a plurality of test piece placement slot. The transmission assembly is connected to the base andconnected with the grinding and polishing assemblies in a transmission mode. The grinding and polishing assemblies are partially and tightly attached to the test piece placement slot groups. According to the multi-plate test piece surface grinding and polishing device and method, grinding and polishing at any angle can be achieved, grinding and polishing of a plurality of test pieces can be carried out simultaneously, pla