BONDED WAFER METROLOGY

Wafer edge profile images are analyzed at locations around a bonded wafer, which may have a top wafer and a carrier wafer. An offset curve is generated based on the wafer edge profile images. Displacement of the top wafer to the carrier wafer is determined based on the offset curve. The wafer edge profile images may be generated at multiple locations around the wafer. The wafer edge profile imagesmay be shadowgram images. A system to determine displacement of the top wafer to the carrier wafer can include an imaging system connected with a controller. 在可具有顶部晶片及载体晶片的接合晶片周围的位置处分析晶片边缘剖面图像。基于所述晶片边缘剖面图像产生偏移曲线。基于所述偏移曲线确定所述顶部晶片到所述载体晶片的位移。可在所述晶片周围的多个位置处产生所述晶片边缘剖面图像。所述晶片边缘剖面图像可为轮廓剪影照片图像。用以确定所述顶部晶片到所述载体晶片的位移的系统可包含与控制器连接的成像系统。