SPUTTERING APPARATUS AND METHOD OF USING THE SAME

Provided is a sputtering apparatus capable of improving discharge of a cooling liquid and a method of using the same, comprising: a ring-shaped first coolant flow path (R1) formed in a target (110) and a magnet unit (130) Between the cooling liquid flowing through the cooling target (110); the secon...

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Bibliographische Detailangaben
Hauptverfasser:	WATABE ARATA, AONUMA DAISUKE, ABE YAMATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Provided is a sputtering apparatus capable of improving discharge of a cooling liquid and a method of using the same, comprising: a ring-shaped first coolant flow path (R1) formed in a target (110) and a magnet unit (130) Between the cooling liquid flowing through the cooling target (110); the second cooling liquid flow path (R2) is disposed inside the magnet unit (130), flows through the coolingliquid; and the liquid discharging device (P2) The first coolant flow path (R1) feeds the gas that discharges the coolant toward the second coolant flow path (R2), and the first coolant flow path (R1)and the second coolant flow path (R2) The connection portion (RJ) is configured to be disposed at a position below the vertical direction in the annular first coolant flow path (R1). 提供一种能够提高冷却液的排出性的溅射装置及其使用方法，其特征在于，具有：环状的第一冷却液流路(R1)，形成于靶(110)和磁铁单元(130)之间，流过冷却靶(110)的冷却液；第二冷却液流路(R2)，设置于磁铁单元(130)的内部，流过所述冷却液；以及排液装置(P2)，从第一冷却液流路(R1)朝向第二冷却液流路(R2)送入使所述冷却液排出的气体，并且第一冷却液流路(R1)和第二冷却液流路(R2)的连接部位(RJ)构成为能够配置于环状的第一冷却液流路(R1)中的偏铅垂方向下方的位置