Semiconductor power module and arrangement material bonding method thereof

The invention discloses a semiconductor power module and an arrangement material bonding method thereof. The semiconductor power module is provided with a housing and a switching device for the arrangement on a base member. The switching device includes a circuit board having a second surface configured for an arrangement on a respective third surface of the base member, the other components beingdisposed on a side of the circuit board that faces away from the second surface. The housing at least partially encloses the switching device on at least two mutually opposite sides, each of which isprovided with a fixing device, with only one or at least one first fixing device including a first surface. The first surface is arranged parallel and offset to the second surface, and is recessed relative to the second surface from a direction of the third surface. The fixing device includes a stop element configured to withstand first force, with the first force compressing the first surface ina direction of the third s