Sputtering target material preparation process based on plasma spraying technology
The invention discloses a sputtering target material preparation process based on a plasma spraying technology. The process comprises the steps that to-be-sprayed powder is processed to be within theparticle size range used for plasma spraying; the surface of a bottom board is subjected to surface t...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a sputtering target material preparation process based on a plasma spraying technology. The process comprises the steps that to-be-sprayed powder is processed to be within theparticle size range used for plasma spraying; the surface of a bottom board is subjected to surface treatment meeting the plasma spraying; the prepared to-be-sprayed powder is sprayed to the treated surface of the bottom board through a plasma spraying machine; and the sprayed bottom board is cleaned and detected. The sputtering target material preparation process uses the plasma spraying technology for preparing a target material, and the target material gas the high compactness (with the relative density of 93%) and high purity the same as primary powder materials; and compared with a hot pressing or sintering method, the preparation process not only can meet the preparation requirements of large-size target materials meeting the production demands of hull cells, but also can be used formanufacturing of target m |
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