A method and apparatus for depositing a passivation film and a passivation film deposited thereby

The present disclosure relates to a method and apparatus for depositing a passivation film and a passivation film deposited thereby, the method comprising: supporting a substrate on a substrate support; injecting a source gas and a reaction gas onto the substrate by using a linear deposition source...

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Bibliographische Detailangaben
Hauptverfasser:	HWANG DONG-EUI, JUNG TAE-HOON, LEE JAE-SEUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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