A method and apparatus for depositing a passivation film and a passivation film deposited thereby
The present disclosure relates to a method and apparatus for depositing a passivation film and a passivation film deposited thereby, the method comprising: supporting a substrate on a substrate support; injecting a source gas and a reaction gas onto the substrate by using a linear deposition source...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure relates to a method and apparatus for depositing a passivation film and a passivation film deposited thereby, the method comprising: supporting a substrate on a substrate support; injecting a source gas and a reaction gas onto the substrate by using a linear deposition source comprising a linear source gas nozzle and a linear reaction gas nozzle, wherein the linear source gas nozzle and the linear reaction gas nozzle are arranged in parallel in a first axis direction intersecting with the substrate; moving the substrate support or the linear deposition source in the second axis direction intersecting with the first axis direction. Movement in one direction and movement in the other direction in the second axis direction are alternately performed in the step of movingthe substrate support or the linear deposition source, and the movement distance in the one direction and the movement distance in the other direction are different.
本公开涉及用于沉积钝化膜的方法及设备以及从而沉积的钝化膜,方法包括:将衬底支撑在衬底支撑件上;分别使用包括线性源气体 |
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