THERMOELECTRIC MODULE SHEET AND THERMOELECTRIC MODULE ASSEMBLY HAVING THE SAME
The present disclosure relates to a thermoelectric module sheet that includes a base substrate, a plurality of thermoelectric elements laminated on a surface of the base substrate, and a plurality ofelectrodes, each of which is laminated on at least one surface of at least one of the plurality of th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure relates to a thermoelectric module sheet that includes a base substrate, a plurality of thermoelectric elements laminated on a surface of the base substrate, and a plurality ofelectrodes, each of which is laminated on at least one surface of at least one of the plurality of thermoelectric elements to electrically connect the plurality of thermoelectric elements by a predetermined connecting method.
本公开涉及一种热电模块板,包括:基底基板;多个热电元件,层压在基底基板的表面上;和多个电极,每个电极层压在多个热电元件中的至少一个热电元件的至少一个表面上,以通过预定连接方法电连接多个热电元件。 |
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