Semiconductor devices having wire bonding structures and methods of fabricating same

A semiconductor device includes a first device having a first pad; a second device having a second pad; and a bonding wire electrically connecting the first device and the second device to each othervia the first pad and the second pad. The bonding wire includes: a first bonding structure provided a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE SEUNG-LO, HAN HO-SOO, LEE YONG-JE, CHO SUNG-IL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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