Semiconductor devices having wire bonding structures and methods of fabricating same

A semiconductor device includes a first device having a first pad; a second device having a second pad; and a bonding wire electrically connecting the first device and the second device to each othervia the first pad and the second pad. The bonding wire includes: a first bonding structure provided at a first end of the bonding wire, electrically connected to the first device and includes: a firstball bonding region; and a first stitch bonding region; and a second bonding structure provided at a second end opposite of the first end of the bonding wire and electrically connected to the seconddevice. 一种半导体器件包括：具有第一焊盘的第一器件；具有第二焊盘的第二器件；以及接合引线，通过第一焊盘和第二焊盘将第一器件和第二器件彼此电连接。接合引线包括：第一接合结构，提供在接合引线的第一端处，电连接到第一器件，并包括第一球接合区域和第一针脚式接合区域；和第二接合结构，提供在接合引线的与第一端相反的第二端处并电连接到第二器件。