FLOATING PACKAGE STIFFENER

Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesiveadjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiment...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HO YING ERN, HSU HAO-HAN, LEE JAEJIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesiveadjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed. 在此的实施例可以涉及具有一个或多个层的封装。硅管芯可以经由粘合剂与所述一个或多个层耦合。封装加强肋也可以与邻近于管芯的粘合剂耦合。磁性薄膜可以与封装加强肋耦合。可以描述和/或要求保护其它实施例。