LASER ABLATIVE DIELECTRIC MATERIAL

Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to nodebris post-ablation. 提出了用于激光烧蚀图案化的具有最佳机械性能的介电材料。这些材料包括选自下组的聚合物：聚脲、聚氨酯和聚酰腙。还提供了制备合适聚酰腙的新型方法。这些方法涉及温和条件，并且获得在室温下稳定的可溶性聚合物，并且其可以掺入能够涂覆到微电子基材的制剂中。介电材料表现出高伸长率、低CTE、低固化温度、并且在消融后留下很少的碎屑甚至不留下碎屑。