DEPOSITION SYSTEM

According to the present disclosure, a processing system (100) for depositing one or more layers on a substrate supported by a carrier is provided. The processing system includes: a load lock chamber(110) for loading a substrate; a routing module (410) for transporting the substrate; a first vacuum swing module (131); and a process module (510) including a deposition source for depositing material; a service module (610); an unload lock chamber (116) for unloading the substrate; a further routing module (412); a mask carrier magazine (320) configured for storing and transporting masks employed during operation of the processing system; a further vacuum swing module (132); and a transportation system (710) configured for transporting the carrier between the first vacuum swing module (131)and the further vacuum swing module (132). 根据本公开内容，提供一种用于在由载体支撑的基板上沉积一个或多个层的处理系统(100)。处理系统包括：装载锁定腔室(110)，用于装载基板；路由模块(410)，用于输送基板；第一真空摆动模块(131)；和处理模块(510)，包括沉积源，沉积源用于沉积材料；维修模块(610)；卸载锁定腔室(116)，用于卸载基板；另外的路由模块(412)；掩模载体匣(320)，经配置