Power-supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides

The invention relates to a power-supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides. An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an el...

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Bibliographische Detailangaben
Hauptverfasser: JIAN YIN, VISHWANATH KELKAR NIKHIL, MICHAEL ALTHAR
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a power-supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides. An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example,such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shieldingspecified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if themodule components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components. 本发明涉及沿两侧或更多侧的具有电磁干扰(EMI)屏蔽、冷却或屏蔽冷却兼有的电源模块。电源模块的一实施例包括具有多个侧的封装件、设置在