Porous polyurethane polishing pad and method for manufacturing same

The embodiment relates to a porous polyurethane polishing pad used in a chemical mechanical planarization process of a semiconductor, and a method for manufacturing the same, wherein polishing performance of the porous polyurethane polishing pad can be controlled by controlling the size and distribution of pores by using thermally expanded microcapsules as a solid phase forming agent, and an inertgas as a gas phase foaming agent. 本发明实施方式涉及一种用于半化学机械平坦化的多孔聚氨酯抛光垫及其制备方法。通过热膨胀微胶囊和惰性气体作为气相发泡剂，可以控制多孔聚氨酯抛光垫中孔的尺寸和分布，从而可以调节其抛光性能。