Multilayer superposed connecting structure of ceramics and metals
The invention discloses a multilayer superposed connecting structure of ceramics and metals. The structure achieves the connection between the ceramics and the metals by utilizing an injection moldingtechnology and is prepared by superposing the ceramics and the metals with each other. When a moldin...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a multilayer superposed connecting structure of ceramics and metals. The structure achieves the connection between the ceramics and the metals by utilizing an injection moldingtechnology and is prepared by superposing the ceramics and the metals with each other. When a molding mode is injection molding, a metal material is firstly injected and then a ceramic material is injected, so that the metal material wraps the ceramic material; the sinter molding temperature of the ceramic material is between 1300 DEG C and 1500 DEG C and the molding temperature of the metal material is between 1300 DEG C and 1400 DEG C. According to the multilayer superposed connecting structure disclosed by the invention, the metal material can wrap the ceramic material during injection molding, so that the metals and the ceramics can simultaneously shrink in the molding process; the metals always have an extrusion effect on the ceramics, which ensures the close connection between the two substances, so that th |
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